| Product General Characteristic | |
|---|---|
| Product Overview | Nano SIM Socket,H=6.87 R/A DIP |
| Component Type | Receptacle |
| PCB Mount Type | Thru-hole |
| Orientation | Right Angle |
| Physical Characteristic | |
|---|---|
| Housing Material | LCP |
| Contact Material | C5210 |
| Plating Material on Contact Area | Au |
| Plating Thickness on Contact Area | 8u" |
| Circuits | 8pin |
| Pitch | 2.54mm |
| Tail Length | 2.10mm |
| Locating Post | N/A |
| Durability | 2000Cycles |
| Housing Color | Black |
| Electrical Characteristic | |
|---|---|
| Current Rating | 0.5A |
| Max. Voltage | 5.5V |
| Solder Process Characteristic | |
|---|---|
| Solder Process Type | IR Reflow |
| Max. Process Temperature | 260℃ |
| Duration at Max. Process Temperature | 10s |
| Environment Characteristic | |
|---|---|
| RoHS/ Halogen Free(HF) Compliance | HF |
| Others | |
|---|---|
| Packaging | Tray |